The Bond University is putting forth English Pathway Studies Scholarships are accessible for understudies who have gotten an offer to learn at the University, with educational cost help for the English for Academic Purposes (EAP) Program. The English Pathway Studies Scholarship grants $2,500 educational cost abatement towards the cost of the English for Academic Purposes (EAP) Program.
The point of the grant is to help worldwide understudies who have officially gotten an offer from Bond University to initiate either an undergrad or postgraduate degree.
The Bond University is a private not-revenue driven college situated in Robina, Gold Coast, Queensland, Australia. It has been recorded in the worldwide best 20 colleges in the Times Higher Education (THE) Rankings of the Best Small Universities in the World.
In the event that English isn’t your first dialect then you should demonstrate that your English dialect aptitudes are at a sufficiently high level to prevail in your examinations.
Scholarship is available to pursue undergraduate or postgraduate degree.
Scholarship is awarded in the field of English for Academic Purposes (EAP) Programme.
The English Pathway Studies Scholarship awards $2,500 tuition remission towards the cost of the English for Academic Purposes (EAP) Programme.
- Eligible Countries: International students are eligible to apply for the scholarship.
- Entrance Requirements: Applicants must have already received an offer from Bond University to commence either an undergraduate or postgraduate degree.
- English Language Requirements: If English is not your first language then you will need to show that your English language skills are at a high enough level to succeed in your studies.
How to Apply:
- Students must complete the Bond University Online Application Form to receive their program offer before applying for this scholarship.
- Once an offer has been received, students must complete the English Pathway Studies Scholarship Application Form. The form must be completed in full and returned by the relevant application closing date.